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Adhesion and Cure Mechanism Studies for Advanced Lidded Flipchip Applications
Keywords: Adhesion, Cure Mechanism, Lidded Flip Chip Applications
As packages utilizing the next technology nodes increase in power density and end-customers demand more functionality per device, many designs are facing thermomechanical and reliability challenges at an unprecedented level. Area array flip chip packages have become the package of choice for many of these advanced devices. These flip chip packages often require a complex arrangement of polymeric, metal, and ceramic components to work together in order to provide such performance, and maintain that performance for a given set of conditions and durations. One important aspect of this symbiosis is the design of the heat dissipation aspects of the package and how it is integrated with the electromechanical aspects of the package –in particular the adhesive technology used for coupling these two components. In this paper, the adhesive material properties are substantially characterized along with the impact on the assembly process as well as on the package reliability.
Lyndon Larson,
Dow Corning Corporation
Midland, MI

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