Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

TRANSIENT LIQUID PHASE SINTERED INTERCONNECTS FOR HIGH TEMPERATURE APPLICATIONS
Keywords: Harsh Environment, High Temperature, Interconnects
Low Temperature Transient Liquid Phase Sintering (LT-TLPS) enables the formation of joints at low process temperatures that are robust to high temperatures. TLPS systems consist of one or more low temperature constituents (i.e. Sn) and one or more high temperature constituents (i.e. Cu). In this paper, a paste-based LT-TLPS approach is demonstrated. The organic binders and fluxes used to mix the pastes prevent the particles from oxidizing and facilitate joining in air without the need for a reducing atmosphere. Pastes based on the Cu-Sn system have been developed that enable a completely pressure-less joining process. Furthermore, pastes for LT-TLPS in which very low pressures (<0.5MPa) are applied during the initial stage of the sintering process have been developed which form almost void free joints. To assess the strength of the sintered joints, a high-temperature shear fixture has been designed. Tests have been performed at 25C, 400C, and 600C to characterize the influence of high temperature conditions on the joint shear strength. The shear strength of the joints formed without pressure has been assessed for different Cu-to-Sn ratios at these temperature levels. For the low-pressure pastes, the influence of different high melting point constituents on the joint strength was examined. It is shown that the maximum application temperature and shear strength depend on the ratio of low melting temperature and high melting temperature constituents. LT-TLPS pastes can be used to form joints stable to application temperatures of up to 600C.
F. Patrick McCluskey,
University of Maryland
College Park, MD
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems