Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reducing Package Thickness to Accommodate Next Generation Smartphone Designs.|
|Keywords: Thin, SMT, Reliability|
|The current trend in handheld devices – smartphone, tablet, etc., is to reduce total thickness, while at the same time maximize processing power and functionality. Reducing total package height also allows for thermal solutions to mitigate heat generated from high power processors. Thinning overall package height carries several consequences which should be carefully weighed. Package warpage, coplanarity, manufacturability and overall reliability are some of the critical factors to consider for enabling any thinning technology. This paper describes a package thinning strategy by reducing standoff height. Assembly capability, critical package parameters, component and board level reliability results are presented.|
|Brian Roggeman, Engineer, Staff
Qualcomm Technologies, Inc
San Diego, CA