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Reducing Package Thickness to Accommodate Next Generation Smartphone Designs.
Keywords: Thin, SMT, Reliability
The current trend in handheld devices – smartphone, tablet, etc., is to reduce total thickness, while at the same time maximize processing power and functionality. Reducing total package height also allows for thermal solutions to mitigate heat generated from high power processors. Thinning overall package height carries several consequences which should be carefully weighed. Package warpage, coplanarity, manufacturability and overall reliability are some of the critical factors to consider for enabling any thinning technology. This paper describes a package thinning strategy by reducing standoff height. Assembly capability, critical package parameters, component and board level reliability results are presented.
Brian Roggeman, Engineer, Staff
Qualcomm Technologies, Inc
San Diego, CA
USA


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