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Novel back-side grinding and laser dicing process for Cu pillar generated low-k wafer
Keywords: Laser dicing, low-k insulation, Cu pillar
One of the challenges in using very thin die, that is needed in thin package, is how to dice it cleanly without chipping, de-lamination of fragile low-k insulation material and contamination of bonding pads. Narrow dicing line is also highly preferable for high wafer usage. The authors developed a novel
Yuka Tamadate, Manager
Myoko-shi, Niigata

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