Abstract Preview

Here is the abstract you requested from the medical_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Custom Integrated Circuit Design Enables Miniature Implantable Medical Devices
Keywords: Design, Miniature, Implantable
Custom IC design plays a critical role in Implantable Medical Device miniaturization. Recent advances in micro-electro-mechanical systems (MEMS), electronics packaging, and battery technologies have provided excellent opportunities for device miniaturization, but these technologies can be difficult to leverage completely with the use of standard electronic components and ICs. To maximize the benefits of the new technologies, electronic circuits must be designed specifically to their unique characteristics and requirements. Custom IC design provides a level of flexibility to system designers that can be leveraged to maximize the benefits of the other various technology advances, and create Miniature Implantable Medical Devices (MIMDs) that are a fraction of the size of traditional Implantable Medical Devices (IMDs). These new MIMDs can be small enough to implanted at the point in the body where the therapy or sensing is required, thus eliminating the need for long leads or catheters, and enabling minimally invasive surgical procedures. This can lead to lower risk and lower-cost implant procedures. This presentation describes some differences between traditional IMDs and recent MIMDs, and establishes a practical goal of a 4cc total device volume for a common IMD application. It also describes several of the enabling technologies that are leveraged to accomplish this miniaturization goal, including MEMs, electronics packaging, solid-state battery, and custom IC design. The paper then presents the concept of design opportunities, and describes some examples of these opportunities which can be exploited to enable the desired device miniaturization. Some custom IC design techniques used to take advantage of the enabling technologies and the design opportunities are also described. Finally, a practical example is presented of a successful MIMD development, that capitalized on the technologies, opportunities, and techniques described in this work, and resulted in a final device volume of only 1cc.
Andrew Kelly, IC/System Architect
Cactus Semiconductor Inc
Chandler, AZ

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic