Here is the abstract you requested from the medical_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Soldering Technologies Enabling Medical Device Packaging in the 3D Era|
|Keywords: 2.5D and 3D packaging, Solder, Flux|
|The concept of soldering-the melting and solidification of a metal or metal alloy with the formation of a strong intermetallic bond-has endured through the centuries as a means of providing a reliable joint between two interfaces. Most frequently a flux material is used to remove oxides and promote the formation of a strong, void-free interconnect. These fluxes come in many different types, depending on the application, many of them very novel. This paper will review the various forms of soldering pertaining to medical electronics and other types of medical devices and how soldering technology is evolving to meet the challenges of devices that are shrinking in size and becoming more sensitive to manufacturing processes, while also meeting old and new legislative requirements. The paper will also discuss recent advances in the areas of flux and similar materials that are enabling new assembly processes in the era of 2.5D and 3D technology.|
|Carol Gowans, Market Manager