Here is the abstract you requested from the medical_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Low-Silver SAC Solder Alloy for High Reliability Applications|
|Keywords: alloy, solder, high reliability|
|Low-silver SAC alloys are typically known to have higher drop shock resistance, but less thermal cycling reliability, and both aspects of reliability are important for many applications including personal electronics. Nonetheless it is tempting to use low-silver alloys because of the high cost of silver. In order to achieve and maintain high reliability, low-silver SAC alloys often benefit from small additions of other elements (dopants) to promote better performance . Here, SACM has been proposed as a low-silver alloy solution, which features improved drop shock resistance over SAC305, and does not compromise on other aspects of reliability, including thermal cycling performance. This study will discuss how SACM alloys maintain high quality reliability performance, utilizing Mn as a dopant to bolster reliability, while reducing the amount of silver. Results will include JEDEC drop shock, dynamic bend, thermal cycling, and cyclic bend testing, as compared to mainstream SAC alloys and SnPb. Alloy microstructure is also investigated to determine the mechanism for this improved performance. Overall, manganese seems to promote a uniform distribution of fine IMC particles, improving reliability by creating a more stabilized microstructure.|
|Brook Sandy-Smith, Product Support Specialist
Clinton , NY