Here is the abstract you requested from the medical_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Amazing and robust silicon capacitor technology for miniaturization.|
|Keywords: capacitors, high density, reliability|
|The 3D Silicon technology of IPDiA is a disruptive capacitor and passive component technology for miniaturization adopted by the best players in the Medical domain for its very low leakage current, high stability and high reliability. It is also adopted by the Industrial segment for its outstanding performance and reliability demonstrated in high temperature environment. The high density capacitors with multiple metal-insulator-metal (MIM) layer stacks in 3D structures reaching 250nF/mm2 already in production for several years is at the forefront of the research program where 4µF/mm² is the new target to be reached. In this paper, the robustness of the IPDiA technology is exposed, illustrated by reliability results obtained through innovative platforms and packaging configurations used in the field of implantable medical electronic devices.|
|Catherine Bunel, R&D Director