Here is the abstract you requested from the medical_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Multilayer and Injection Molded Ceramics|
|Keywords: multilayer ceramics, injection molded ceramics, metallization|
|The electronic industry moves at light speed developing faster and smaller I/C’s operating in critical environments. High reliability packaging continues to keep pace in providing thermal, environmental and resilient solutions for many diverse applications. While multi-layer ceramic processing patents were established 45 years ago, advancements in materials, modeling and processing continues to evolve. This presentation will focus on providing an overview of the microelectronic packaging technologies that address today’s requirements. The discussion will include new developments combining the attributes of multi layer ceramic processing, injection molding, metal assembly and a variety of metallization options to create unique solutions.|