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Multilayer and Injection Molded Ceramics
Keywords: multilayer ceramics, injection molded ceramics, metallization
The electronic industry moves at light speed developing faster and smaller I/C’s operating in critical environments. High reliability packaging continues to keep pace in providing thermal, environmental and resilient solutions for many diverse applications. While multi-layer ceramic processing patents were established 45 years ago, advancements in materials, modeling and processing continues to evolve. This presentation will focus on providing an overview of the microelectronic packaging technologies that address today’s requirements. The discussion will include new developments combining the attributes of multi layer ceramic processing, injection molding, metal assembly and a variety of metallization options to create unique solutions.
Bill Minehan,
AdTech Ceramics
Chattanooga, TN

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic