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Packaging Matersils for 2/5/3D Technology
Keywords: 2.3/3D, underfills, therma compression bonding
The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high yield, low cost are words engineers are too familar with. 2.5/3D utilizing interposer technology, Thru Silion Via (TSV), sub 50um die thickness are a few of the lastest technologies engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu plilar bumps, thermal compression bonding (TCB) and wafer level / pre-applied materials. This presentation will centralize around the latest advancemants in Namics Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive paste (NCP), Non-Conductive Films (NCF).
Brian Schmaltz,
NamicsTechnologies inc.
San Jose, Ca, Ca

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