Abstract Preview

Here is the abstract you requested from the nano_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Infusion of next generation of nano devices into military/space standards.
Keywords: Packaging, Technology, Standards
Abstract: Advances in packaging and device technology are happening rapidly. How do we enable space flight projects to take advantage of the newly developed devices? NASA is leading a G12 initiative, called Class Y, with the purpose of infusing one new type of complex devices into military/space standards. The Class Y is envisioned as a new category of ceramic-based nonhermetic microcircuits, such as the Virtex-4 and Virtex-5 field programmable gate arrays (FPGAs) offered by Xilinx Corporation. Creation of a new class of microcircuits such as Class Y requires considerable effort. It needs to be coordinated with manufacturers, government agencies, prime contractors, and other interested entities (e.g., academia). It also needs to ensure that various aspects of packaging configuration such as flip-chips, underfills, adhesives, column attaches, and others are adequately covered by the military documents, MIL-PRF-38535 and MIL-STD-883. New test methods are being created and the existing standards are being updated as found necessary. This paper provides the details of this effort. The paper concludes with some thoughts on how to continually infuse the next generation of devices into military and space standards.
Shri Agarwal, Program Manager
Pasadena, Ca

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic