Here is the abstract you requested from the nano_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wedge Bonding New Wire Alloys for Nano Applications|
|Keywords: Ultrasonic bonding, wedge bonding, bonding wire|
|Currently the price of gold is $1575/troy-oz and it has been holding above $1000/tr-oz for the past 3 years. The high price of gold represents more than $10 billion/year just in materials cost for bonding wire and has led to the rapid conversion of gold ball bonding to copper wire. Currently approximately 15% of the entire market has converted and as early production problems have been resolved and more products have been successful the trend has increased. Initial conversions were less expensive, lower reliability devices but more advanced products are right behind. There are, however, devices that will not convert. Wedge bonding has traditionally used either Al or Au wire for interconnection but recently new silver alloy wires have become available. Earlier, pure silver wires had reliability problems when bonding to Al bond pads, during 85C/ 85%RH testing they were reported to lose 90% of their bond strength in less than 10 hours. The new silver alloy wires, because of their chemical composition, are reported to survive accelerated testing. Nano- materials and devices incorporate a new class of materials with sub-micron grain size and unique properties to form smaller features and functions than previously achievable. Wedge bonding, because of its smaller bond size, room temperature bonding, lowest loop capabilities and low cost is the best interconnect method for these new devices. The discussion will focus on the use of fine pitch wedge bonding for nano-electronic interconnections.|
|Lee Levine, Distinguished Member of the Technical Staff
Hesse Mechatronics Inc
New Tripoli, PA