Here is the abstract you requested from the nano_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Novel Underfill For 3D TSV Package|
|Keywords: 3 D TSV, Underfill, flip chip|
|Due to more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize device and meet the demand of high speed, more memory, more function and low cost, 3D TSV (Through Silicon Vials) has been attracted more and more attention now. However there are a lot of drawbacks occurred in the manufacturing process such as assembly and reliability issues. Underfill is normally used to enhance the reliability, but it is very difficult for underfill to flow into the 10-micron gap in 3D TSV. In order to resolve this issue YINCAE has successfully developed a unique underfill which not only function as traditional underfill such as flip chip but also work very well for 3D TSV 10 micron gap package. YINCAE underfill series allow fast flow into 3D TSV package and fast cure. After underfilling and cure, there are no voids observed in underfill. In this paper, a total of four different underfills have been studied. Compared to the other flip chip underfill, YINCAE underfill has demonstrated both excellent workability and outstanding reliability. In terms of workability and reliability, the four different flip chip underfills can be ranked in the following order from best to worst: A underfill > B underfill > C underfill > D underfill.|
YINCAE Advanced Materials, LLC