Here is the abstract you requested from the nano_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Solder Joint Encapsulant Adhesive – POP TMV High Reliability And Low Cost Assembly Solution|
|Keywords: POP TMV, Solder joint encapsulant, underfill|
|In order to meet the industrial demand of miniaturization, design flexibility and cost efficiency, POP ( package on Package) TMV ( Through Mold Vials) has been increasingly used in mobile devices, tablet and PC. However, there are some issues occurred in manufacturing process: (1) head-in-pillow defects due to large warpage; (2) nitrogen protection needed; (3) more difficulty in underfilling process; (4) electromigration due to the formation of dendrite; (5) more difficulty in rework process. YINCAE solder joint encapsulant SMT 256 has been approved to the best solution for POP TMV assembly. Solder joint encapsulant is used in line soldering process with enhancing soldering capability, eliminating underfilling process and providing execellent reworkability. The shear strength of solder joint is stronger than underfilled componets. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. All details such as assembly process, drop test and thermal cycling test will be discussed in the full paper.|
YINCAE Advanced Materials, LLC