Here is the abstract you requested from the nano_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of Glass and Silicon 3D-IC Interposers: A Comparison in Performance and Reliability|
|Keywords: Interposers, glass, silicon|
|Glass has many properties that make it an ideal substrate for important 3D-IC applications such as interposer substrates and glass carrier wafers. Critical material properties such as: ultra-high resistivity, low dielectric constant, ultra-low electrical loss and tailorable CTE provide unique advantages. Forming processes such as fusion forming process provide additional advantages around the ability to provide low total thickness variation (TTV) without downstream grinding and polishing processes providing positive implications on both cost and performance. The ability to scale substrate sizes (450 mm wafers or panels) and thickness (down to 100 µm) as well as panels provides tremendous advantages for the ability to scale for high volume manufacture. Just as important as being able to provide glass with these important attributes, is the ability to properly characterize them. We will provide a summary highlighting the importance of the glass attributes in both glass interposer and carrier applications, as well its implications of using the appropriate metrology solution to characterize them. We will also share data which will illustrate the importance of metrology for glass carriers and the functional influence on performance. For interposer substrates, fully populated wafers with >100,000 through and blind holes (≥ 25 µm diameter) are fabricated today and 10-20 µm diameters are in development. We will report on important quality parameters measured on TGV wafers and positive implications with respect to product strength. We will also provide results showing progress made in developing downstream processes such as via metallization and redistribution layers (RDL). This includes the fabrication of complete test vehicles made with glass and silicon interposers. Finally we will share data comparing reliability and performance (electrical and thermal) of both the glass and silicon test vehicles.|
|Aric Shorey, Sr. Technical Manager