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Chemically Vapor Deposited Polymer Coatings for the Environmental Protection of Micro- and Nano-Electronics
Keywords: CVD, siloxane, conformal
Initiated chemical vapor deposition (iCVD), a new platform technology for CVD of polymers, enables the fabrication of chemically well-defined, thin polymeric films on complex two- and three-dimensional micro- and nano-scale features which protect delicate electronics from environmental hazards. iCVD requires low energy input which affords high chemical functional group retention, and low process temperatures enable temperature-sensitive substrates to be coated at or near room temperature. No solvents or dispersants are necessary, allowing chemically pure polytetrafluoroethylene (PTFE) and siloxane coatings to be deposited dry and without additional curing. By depositing from the vapor phase, common issues such as uneven thicknesses resulting from solution and wetting effects are avoided and highly conformal films are created. The unique gas-phase technology allows polymeric coating to penetrate into high-aspect-ratio features and areas not reachable with standard industry techniques such as beneath integrated circuit components and into through-silicon vias, ensuring full coverage of any sensitive electronics with high-dielectric-constant siloxane polymer. iCVD siloxane polymers deposited by GVD’s process meet or exceed many industry-standard tests for dielectric withstanding voltage, salt-fog corrosion, insulation resistance, moisture resistance, and temperature humidity aging.
Seth Johnson, R&D Scientist
GVD Corporation
Cambridge, Massachusetts
USA


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