Here is the abstract you requested from the nano_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Nano-Materials for Thermal Conductive Materials|
|Keywords: Nano, thermal conductivity, semiconductor packaging|
|Abstract: Nano materials have been around for decades. Nanocarbon materials are more accessible today than ever before. The intrinsic thermal properties of many of the nanocarbon materials make them highly desirable in applications that require high thermal conductivities. In addition other nanoparticles such as nano-silver, nano-aluminum, and nano-diamonds are providing advantages that may not be obvious conceptually. This paper will present a critical review of recently published patents and patent applications that may show improved thermal properties by taking advantage of the properties of these nanomaterials, and also the conceptual applications of these nano-materials in packaging electronic from chip to device levels. This paper will also present preliminary data on thermal properties of packaging materials that uses nano-scale particles compared to traditional particles.|
|Fred Lo and Kevin Chung, Product Manager
AI Technology, Inc
Princeton Junction, NJ