Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The needs and opportunities for thermal management in consumer electronics|
|Keywords: thermal management, consumer electronics, cooling challenges|
|thermal issues have gained significant importance, and thermal management technology has evolved to make consumer electronics devices more versatile and powerful in a compact enclosure. In this presentation, we will share the trend of consumer electronics for the past ten years and corresponding development of thermal management technologies to solve the cooling challenges therein. In this presentation, we will show how the needs for thermal management have evolved. For example, the advancement of projection display devices initiated the development of high-performance robust heat dissipating devices, and the miniaturization technology of a liquid cooling system enabled thermal management of high-power LEDs and Xenon lamps with higher brightness, lower acoustics and longer life time. In addition, as more devices incorporate sleek design and portability becomes increasingly important for devices such as smart phones, it led to the development of very thin heat spreaders to manage heat from sources. In response, graphite products and heat pipes have evolved every year, achieving high conductivity of over 1500 W/mK and thickness of 0.6 mm respectively. The trend of high-power density in consumer electronics is expected to continue and we will discuss how these evolving thermal management needs can be met with future technologies. Finally, we will propose how inter disciplinary cooperation between academia and industry can contribute to the successful implementation of consumer electronics technologies.|
|Sung Ki Kim,