Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|New Developments in Flexible Graphite Thermal Interface Materials|
|Keywords: Thermal Interface Material, Flexible Graphite, Properties|
|GrafTech International Ltd. produces a family of eGRAF® HITHERM™ flexible graphite Thermal Interface Materials (TIMs) for a wide variety of applications. Their combination of low contact resistance, excellent thru-thickness thermal conductivity, high in-plane thermal conductivity and relatively high bond line thickness makes them an optimal choice for large area TIMs. This paper reviews the properties of current flexible graphite TIMs and introduces new material developments that can provide lower thermal resistance, increased compressibility and higher in-plane thermal conductivity. An overview highlights the unique performance options provided by flexible graphite TIMs that can be leveraged into an increasing number of new applications.|
|Martin Smalc, Research Associate
Graftech International Holdings Ltd.