Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Device Level Thermal Characterization for Photonics and Power Devices|
|Keywords: Thermal imaging, power device, optical device|
|Infrared (IR) Thermography has been widely used as a tool for thermal mapping and characterization of devices and systems. This technique conveniently provides non-contact measurement and the resulting 2-D thermal map provides a global view of the thermal characteristics of the target device. However, there are some major limitations with this technique in terms of spatial and temporal resolution, especially for photonic or high power device applications. The thermoreflectance thermal imaging provides a solution that addresses these challenges. We will demonstrate this capability with examples and provide the scientific background for this imaging technique. The equipment is commercially available with visible light optics, a CCD image sensor, and with sophisticated user-friendly software and the applicable signal control electronics. In contrast to typical InGaAs or InSb sensor array for IR Thermography, the visible CCD sensors are mass produced and can provide a greater number of pixels.|
|Kazuaki Yazawa, Research Scientist
Santa Clara, CA