Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Ultra-thin B-staged thermoplastic polyimide bondfilm|
|Keywords: Ultra-thin thermoplastic polyimide TIM, All-polyimide durability, Simple and quick lamination processing|
|Thermal-management bondlines utilizing thermoplastic polyimide adhesive (TPI) are very durable across a wide range of environmental conditions (thermal, physical, chemical), can withstand an extreme CTE-mismatch between laminated materials, and provide excellent adhesion in thicknesses down to only a few micron. A TPI TIM bondline in an electronic packaging application can provide a thermal-impedance of less than 0.1oC-sqin/W, a shear strength of several thousand psi, and can withstand continuous operation of over 250oC, as well as liquid thermal shocks of over 300oC. These features make TPI bondfilms ideal for heat-sealable TIMs and thermal-management circuitry. By only partial-curing, or B-staging, the TPI adhesive polymer during the bondfilm manufacturing process, the required lamination conditions – temperature, pressure and time – are significantly decreased, versus the lamination of conventional (fully cured) TPI systems, which require very specialized equipment and processing. In fact, the B-staged TPI bondfilm can produce robust thermal-management laminations by merely placing binder-clipped assemblies in a toaster oven until the bond temperature is reached. Key word: Thermoplastic polyimide adhesive (TPI), thermal-interface material (TIM), CTE-mismatched lamination, all-polyimide bondline.|
|Jim Fraivillig, President
Fraivillig Technologies Company