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Embedded (Near Source) Cooling—Application to Next Generation Thermal Management Systems
Keywords: Embedded Cooling, High Efficiency cooling, Thermal packaging
Many industrial sectors rely on high-performance thermal management, including applications in electronics cooling, waste heat recovery, ocean thermal energy conversion, and advanced thermal and electrical energy storage. Most of the state of the art systems suffer from insufficient cooling rates, compactness, dynamic control of the temperature, and reliable operation of the system under variable load conditions [1-2]. To address these problems, embedded (near source) micro-thin film cooling shows promise. This technique relies on the careful design of the microstructure-based heat/mass transfer surface, precise flow delivery, and proper microfluidics design to optimize liquid and vapor flows. The technique can be applied to a diverse range of applications, including high power/high temperature electronics, as well as applications involving telecom and portable electronics devices. In this presentation I will review the principles and share some recent research results based on experimental and computer simulation studies [3-4].
michael M. Ohadi, Professor
University of Maryland
College Park, MD

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic