Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Enabling Innovation and Integration in Electronic Packaging: Are Modeling, Simulation and Measurement Capabilities Falling Behind?|
|Keywords: Keynote, Modeling and Simulation Tools, Metrology Tools|
|Advances in electronic packaging have supported silicon technology scaling and the package has evolved to become an important enabler of product performance and differentiation. The various market segments ranging from consumer electronics, hand held devices such as phones, tablets, UltrabooksTM and convertibles, to high performance servers; result in an extremely diverse set of designs, multiple levels of integration, materials, and manufacturing processes, extending from 2D, 2.5 to 3D packaging architectures. The engineering of semiconductor packaging has advanced over the past decades and has kept pace with supporting higher performance and cheaper computing devices with hundreds of millions of transistors. The rate of progress in this area will continue to require significant improvements in the collaterals required to enable time-sensitive and cost-effective technology development. This includes appropriate modeling/simulation software tools and measurement tools /techniques for the analysis, characterization, validation and optimization of the different steps of the assembly manufacturing and test process, materials used, mechanical integrity, signal integrity, power delivery and thermal management. Given the pace of feature scaling, level of functional integration, drive to ubiquitous computing, and smaller devices and form factors, are these tools losing the race? Are the modeling, simulation and metrology tools and methods keeping pace with electronic packaging technologies that are required to sustain Moore’s Law? Do they provide the right level of capability to help understand and quantify responses to enable cost/performance effective trade-offs and drive decisions across design, materials and manufacturing process parameters for current and future technologies? A critical review of this area will be presented. This presentation will first provide an overview of typical current and future package technologies and associated demands across the different market segments. Challenges that need to be addressed for facilitating the effective analysis and characterization to enable efficient design, materials selection and associated assembly and test manufacturing processes will then be reviewed. This will be mapped to an assessment of the current state-of-the-art and the areas of opportunities where analysis and measurement tools and methods do not provide adequate capability. The role of inter-disciplinary solutions and the need for new competencies will be discussed. A broad perspective of the need for improved solutions, including multi-physics and multi-scale approaches, will be reviewed. Recent trends in technologies, advanced analysis / simulation tools and metrologies and their applications to electronic packaging will be comprehended.|
|Gaurang Choksi, Director, Core Competencies, Assembly & Test Technology Development