Micross

Abstract Preview

Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Managing temperature difference between critical components
Keywords: Cooling, Temperature differences, Components balance
High performance electronic systems, using parallel circuits or components, require precise management of component temperatures. Therefore it is critical to have the components working at the same temperature. The standard solution is to have parallel cooling which means providing the same amount of cooling fluid at the same temperature to each identical component. However, this solution requires a high flow rate which often cannot be obtained. We propose a solution that will work with either air or liquid using serial cooling at a reduced pressure drop. The objective is to manage the thermal resistance between the fluid and the component to maintain, in all situations, the same junction temperature. We will do that within a single part to simplify the system assembly and guarantee performance. The design process implies 3 mains steps: - Define the worst case cooling parameters for the last component of the serial configuration. - Define the heat sink thermal resistance for each component placed upstream. - Define the flow management vs. the systems loads.
Guy Diemunsch, Director of Engineering Europe
Electronic Cooling Solutions Inc.
Seyssinet Pariset, Isere
France


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems