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Challenges of Thermal Interface Materials in Test of IC Packages
Keywords: Test, TIM, dynamic cycling
Thermal Interface Materials (TIMs) are commonly used to lower the thermal resistance between a silicon die and an integrated heat spreader (IHS) as they provide a conductive interface between two surfaces of dissimilar materials. In the testing of packages in high volume manufacturing (HVM), thermal tools are used to control the temperature of the package to meet quality control criteria. A TIM is used between the thermal tool and the package dynamically, namely, the same tool is re-used to test the next package. This poses additional challenges to the performance of the TIM which make the selection of suitable materials more complex than a typical application. This work highlights some of the challenges faced in the semiconductor industry and the requirements of TIMs used in test to meet targets of cost and reliability.
Jaime A. Sanchez, Test R&D Engineer
Intel Corporation
Chandler, AZ
USA


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