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Heatsink Thermal Analysis and Optimization using BOE Calculations
Keywords: Heatsink, Calculations, Design
Ernie Thurlow September 19, 2013 IMAPS ATW 2013 Presentation Abstract Sizing and designing heatsinks for electronics cooling is often accomplished using historical system design experience or time consuming iterative thermal simulations without first conducting back of the envelope (BOE) calculations. Using mathematical correlations before assuming, or simulating, a heatsink design may greatly reduce product time to market if applied using a methodical approach. When trying to lower a heatsink’s thermal performance there is a trade off between rising pressure drop, Delta_P, and convection resistance (1/hA). If a small effort is taken to implement BOE calculations, using a methodical approach, then an optimal design for most flow regimes can be quickly converged upon. This paper will focus on an algorithm that will hopefully provide a thermal design engineer with a tool to reduce heatsink design time for different system flow regimes prior to running a computational fluid dynamics (CFD) simulation model.
Ernest Thurlow, Thermal Design Engineer
San Jose State University
Mountain View, CA

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