Micross

Abstract Preview

Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Paractical Aspects of Thermal Interface Material Testing Methods
Keywords: Interface, Testing, ASTM D 5470-12
A description will be given of recent requirements and developments for testing of thermal interface materials for electronics applications, with comparison of the different test methodologies available. This presentation will focus on describing three common test methods and will identify several types of test equipment which is commercially available for testing TIM materials, as well as updates on these topics and standards. Test methods which will be included are: - ASTM D 5470-12, with latest updates - Thermal test vehicles - Transient or dynamic testing The purpose is to illustrate in a non-commercial manner how these test methods differ, when they are most appropriate for use, and some of the advantages and disadvantages of each. Commonly-asked questions will also be included, with answers. Comparative test data between test methods is very helpful in understanding how these methods and how well very different test set-ups can generate good correlations between data sets. References for further evaluation will also be included.
David L Saums, Principal
DS&A LLC
Amesbury, MA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems