Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Liquid Dispensed Thermally Conductive Materials|
|Keywords: Liquid, TIM, Dispense|
|Thermally conductive liquid dispensed materials, especially one and two component curable type, are increasingly taking a bigger share of thermal interface materials market. This trend, at the expense of traditional pad like materials, is expected to continue due both to financial as well as performance related reasons. Liquid dispensed materials like adhesives, encapsulants and sealants have long been part of electronics packaging materials portfolio. Thermally conductive liquids however differ in some very significant ways. The rheology, handling and dispensing characteristics of these multi-phase materials are quite distinct and present unique challenges and opportunities. We will present the basic material science of thermally enhanced liquid and how it relates to key performance and manufacturing characteristics. Fundamental differences vis-à-vis solid pad like materials and unfilled liquids will be highlighted. We will also provide some real world examples of dispensing, performance, reliability and handling of such materials|
|Sanjay Misra, Director of R&D
The Bergquist Company