Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of a Novel Reliable TIM1|
|Keywords: TIM1, thermal interface material, reliability|
|The first thermal interface material between a heat generating component such as a CPU and the ambient is commonly called TIM1 and it is positioned between the component and the lid of its electronic package. The reliability of the TIM1 is essential for long term problem-free operation. The majority of these TIM’s are crosslinkable silicone based gels having thermal conductivities of up to about 4.0 W/mK. Indium is a high thermal conductivity alternative choice for TIM1 for use in the highest performance applications. Reliability is a subject that receives great attention by chip packagers. Recent research has shown that a relatively soft thermoplastic material having a melting/softening point higher than the operating temperature of the electronic device may also be used as a reliable TIM1. We will present accelerated life testing data for this new approach to TIM1. The data shows improved thermal performance over time, likely due to improved surface wetting and filler re-arrangement. These new materials have the added benefit of a thermal conductivity greater than 5 W/mK which should result in improved heat transfer over today’s polymeric TIM1 products.|
|Jason L. Strader, Technology Leader, Thermal Interface Materials