Micross

Abstract Preview

Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

The effects of bending on heat pipes and vapor chambers: Guidelines from real products
Keywords: heat pipes, vapor chambers, bending
The vast majority of applications using heat pipes require bending to fit them into the device to be cooled. To a lesser extent, vapor chambers are also bent along the flat axis. A review of previous publications on this topic shows a wide range of theories and studies, some applicable and some not! In the presentation we will review the key performance parameters in these devices. Look at what parameters the bending affects and review test data on both straight and bent devices. The effects of bending can range from negligible to a significant reduction in total qmax and delta-t. This presentation will show how to determine where a design falls in this range. Give you an understanding on how these devices really work and what you can expect when you design these as bent devices.
George A Meyer IV,
Celsia Inc.
Morgan Hill, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems