Here is the abstract you requested from the thermal_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Test Chip - the Update|
|Keywords: Thermal management, thermal test chip, ttc|
|As thermal management issues continue to dominate new product designs and manufacturing implementation, Thermal Test Chips (TTC) gain increasing importance as a tool for design, material, and assembly validation. This presentation will first describe TTCs and how they are used, then provide a TTC development roadmap that addresses existing and future requirements, including very high power density and Through Silicon Via (TSV) applications. Examples of packaged versions of TTCs will be presented, along with a discussion of their potential applications. Keeping with the general concept of test chips, a new Electrical Test Chip (ETC) will be described. This chip is suitable as a validation tool for electrical and signal integrity simulation activities.|
Thermal Engineering Associates, Inc.
Santa Clara, CA