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Critical barriers in fine pitch applications associated with copper wire
Keywords: copper bonding wire process limitations, Critical barriers in copper wire applications, New emerging bonding wires
The market potential for copper bonding wire is significant as IC and package designers look to reduce costs and address a number of significant interconnect challenges associated with copper bonding wire. Palladium Copper bonding wire was introduced to the industry back in 2008. Palladium copper bonding wire migration is cost savings, with secondary focus for performance and reliability improvement. The critical barriers in fine pad pitch applications associated with bare copper wire such as 2nd bond instability (NSOL), short tails, limited shelf/bonder life (wire oxidation) and high temperature/humidity reliability have been solved with the development of a Palladium coated copper bonding wire. As a result of the maturity of Palladium copper wire, some process and design limitations have been confirmed such as harder FAB’s (free air ball), fine pitch process issues, capillary life and advanced bonding techniques. An improvement and solution is a set of next generation bonding wires which has been introduced as alternative wires to overcome the limitations of the copper wire. Based on evaluations performed, the next generation wires have very good reliability and broader process windows.
William G. Crockett Jr., Business Development Manager, Technical Specialist
Tanaka Denshi
Morgan Hill, CA

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