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Multipurpose Wire Bonding – Wires, Bumps, and Combination Interconnects
Keywords: Optoelectronic Packaging, Ball Bump, Wire Bond
Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps, and specialty interconnects. Multipurpose wire bonders accommodate large work area, deep access, and a complex mix of bond surfaces, wire shapes, and bumps. This paper will provide a survey of application cases highlighting different bumps and wires to show the range of capabilities available to packaging engineers.
Dan Evans, Senior Scientist / Applications Manager
Palomar Technologies
Carlsbad, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic