Here is the abstract you requested from the Wirebonding_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Multipurpose Wire Bonding – Wires, Bumps, and Combination Interconnects|
|Keywords: Optoelectronic Packaging, Ball Bump, Wire Bond|
|Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps, and specialty interconnects. Multipurpose wire bonders accommodate large work area, deep access, and a complex mix of bond surfaces, wire shapes, and bumps. This paper will provide a survey of application cases highlighting different bumps and wires to show the range of capabilities available to packaging engineers.|
|Dan Evans, Senior Scientist / Applications Manager