Here is the abstract you requested from the Wirebonding_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Electrical Current Capabilities & Characteristics of Al Inlay Leadframes for Power Modules|
|Keywords: Al Inlay, Wire Bonding, Electrical Current|
|Power modules are being used in more applications these days in solar, energy, industrial, Hi-Rel, military, power and automotive applications. Many of these modules have amperage levels in the hundreds of amps. This paper will discuss how much current can be handled on typical terminals on aluminum-clad-copper inlay materials used on leadframes in these power modules. Thermal analysis will also be reviewed.|
|Mike McKeown, Power Electronics Manager
Materion Technical Materials