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Gold to Copper Wire Process Adaptive Capillary Changes
Keywords: Wirebonding, Capillary, Geometry
The rapid transition from Gold (Au) wire to Copper (Cu) wire in the semiconductor assembly process requires designs, materials and surface texture changes in wire bonding capillaries. These changes can be adapted and implemented with minimum impact to the wire bonding process on the newer wire bonders. Observations of current technologies impacting capillary design and overall geometry will be discussed as well as its impact in the Copper wire bonding process and specific Copper capillary designs.
Cesar Alfaro,
CoorsTek Gaiser Products
Ventura, CA
USA


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