Here is the abstract you requested from the Wirebonding_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Gold to Copper Wire Process Adaptive Capillary Changes|
|Keywords: Wirebonding, Capillary, Geometry|
|The rapid transition from Gold (Au) wire to Copper (Cu) wire in the semiconductor assembly process requires designs, materials and surface texture changes in wire bonding capillaries. These changes can be adapted and implemented with minimum impact to the wire bonding process on the newer wire bonders. Observations of current technologies impacting capillary design and overall geometry will be discussed as well as its impact in the Copper wire bonding process and specific Copper capillary designs.|
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