Here is the abstract you requested from the Wirebonding_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Impact of Thin, Non-Visible Residues on Gold Wire Bond Reliability|
|Keywords: Residue, Lifted Bond, Reliability|
|During the manufacture of hybrid assemblies, gold bond pads may be masked during processes such as coating and soldering to protect them from contamination and/or damage prior to wire bonding. Despite claims to the contrary, common masking materials such as peelable solder mask and low static tape can leave behind thin, non-visible residues which are detrimental to wire bond reliability. These residues do not always result in adhesion problems (non-sticks) during the wire bonding process, and the residues are most harmful when they cause latent failures such as lifted bonds after thermal cycling rather than initial “non-sticks.” Consequently, residues must be cleaned from the bond sites prior to the wire bonding process in order to prevent long term reliability concerns.|
|Carlyn A Smith, Ph.D.,
Palm Bay, Florida