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Impact of Thin, Non-Visible Residues on Gold Wire Bond Reliability
Keywords: Residue, Lifted Bond, Reliability
During the manufacture of hybrid assemblies, gold bond pads may be masked during processes such as coating and soldering to protect them from contamination and/or damage prior to wire bonding. Despite claims to the contrary, common masking materials such as peelable solder mask and low static tape can leave behind thin, non-visible residues which are detrimental to wire bond reliability. These residues do not always result in adhesion problems (non-sticks) during the wire bonding process, and the residues are most harmful when they cause latent failures such as lifted bonds after thermal cycling rather than initial “non-sticks.” Consequently, residues must be cleaned from the bond sites prior to the wire bonding process in order to prevent long term reliability concerns.
Carlyn A Smith, Ph.D.,
Harris Corporation
Palm Bay, Florida
USA


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