Here is the abstract you requested from the Wirebonding_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Ultra Fine Pitch Wedge Bonding|
|Keywords: wedge bonding, Ultra Fine Pitch, 35 um|
|In the past, ball bonding has dominated the interconnect market because of its high speed & capabilities. But now as interconnect density is becoming greater (the ITRS roadmap predicts that we are heading towards 20µm pitch) ball bonding is reaching its limits. Wedge bonding, because it can produce a smaller full strength weld than ball bonding, has the potential to dominate the market in ultra-fine pitch devices. Wedge bonding, because it directly deforms the wire without 1st forming a ball, is capable of producing a weld with less deformation than ball bonding. High quality welds can be produced with bond width 20-25% larger than the wire diameter. This size is significantly smaller than the minimum size that a ball bonder can produce for the same wire diameter. In order to achieve finer pitch capabilities all bonders must reduce wire diameter. For ball bonders reducing the wire diameter allow ball formation & subsequent deformation with a smaller final bond diameter. However, as wire diameter is decreased conductivity & strength are also reduced. Many new devices require more current & the smaller diameter wire required by finer pitch devices has a negative impact on performance & reliability. Wedge bonding has an advantage, because it can achieve equivalent pitch with a larger diameter wire, or finer pitch with the same diameter wire as ball bonding. With the continuing drive toward finer pitch & the trend toward higher power devices, wedge bonding will become the leader in ultra fine-pitch interconnection. Just as capillary manufacturers had to push their technology in order to make tools capable of achieving fine & ultra-fine ball bonding pitch we, at MPP, as wedge tool manufacturers, together with H&K, bonder manufacturers, cooperated in order to push the state of the art. Together we achieved 35µm pitch with 20µm wire wedge bonding process.|
|Uri Zaks, VP Engineering & Products Support
Micro Point Pro Ltd.
Yokneam Elite, Israel