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The Future of Ag Alloy Wire for wire bonding on Al Pad & IC Applications
Keywords: Wire Bonding, Ag Alloy, Al Pad
Wire bonding continues to be a cost effective interconnection method due the innovations in the wire bond eco system. Industry is aggressively moving away from using Gold wire to Copper Wire due to higher cost of gold. Having produced billions of packages with more than trillion of Cu wire bonded interconnects in high volume, the situation today is, not all the devices can be bonded with Cu wire due to its mechanical properties and its interaction with Chip and package. LED packages have started using Silver(Ag) alloyed wire as an alternate to Gold. Wire suppliers have started introducing Ag Alloy wire for Al pad. With proper alloying & wire bonding optimization these wires have proven to achieve reliable results. Ag alloy is soft like Au wire, squeeze out is reduced and bonding BSOB is less challenging compared to Cu wire. There are many alloy combinations available in the market, the alloying will impact the process optimization, cost and reliability. Currently Ag alloy wire is used for consumer and some retail end applications. In long term, Ag alloy wire could emerge as solution for the devices which can’t be bonded with Cu wire. In this paper, the key challenges, bonding solution and reliability for alloy Ag Alloy will be discussed.
Leroy Christie, Director Process and Package Technology
ASM Pacific Technology, Ltd.
Phoenix, AZ
USA


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