Here is the abstract you requested from the Wirebonding_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Meeting the Next Level of Challenges in HVM on Copper Wire Bonding – A Capillary Perspective|
|Keywords: Copper Wire Bonding, Capillary Design, Solution for Copper Wire Bonding|
|The successful proliferation of copper wire conversion from gold in high volume production has gained momentum since its inception 5 years ago. Assembly process engineers and stakeholders now faced with new challenges to further improve its application using low cost / high density types of packaging materials such as QFN with roughened surface finish, and even bonding on devices with sensitive metalization. All facets of materials used (such as the bonding wire, device, lead frame or substrate, and capillary), wire bonder, process and methods must be considered in defining a stable copper wire bond process. This paper shows how the wire bonding capillary auxiliary geometries can provide adequate solutions to help minimize problems related with bond quality and productivity such as lifted stitch, EFO open, and higher MTBA.|
|Jason Tan, Product Manager
SPT/Small Precision Tools