Here is the abstract you requested from the Wirebonding_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Pitfalls in Wirebonding: how to deal with resonances|
|Keywords: Wire bonding, resonance, ultrasonic frequency|
|Resonance effects can seriously impede or prevent wire bond formation. After briefly looking at the basic physics and mechanisms important in wirebonding, the two major kinds of resonance are discussed: sharp resonances on eigenfrequencies and passive, following resonances over a broad frequency ranges. Dealing with them can be more or less successful. Changing the ultrasonic frequency will remove the true resonance while the passive resonance is independent of the US frequency and can only be avoided by the right fixation of the bonded parts or other approaches which will be discussed in more detail.|
|Josef Sedlmair, International Sales Coordinator
F&K Delvotec GmbH