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Manufacturing of Precise Embedded Resistors by a Tape-on-LTCC Process
Keywords: LTCC, Embedded Resistors, Tape-on-substrate
Among passive elements resistors and capacitors are the most widely used components. Integration concepts to embed resistors in substrates have been introduced for a variety of substrate technologies (e.g. [1]). The biggest barriers for a wider industrial use of embedded resistors so far are mainly their relatively high tolerance in the buried state and the difficulty to trim them to a target value. Older studies on buried resistor behavior in LTCC showed that some resistor materials are suitable for refirings since they stabilize after one refiring [2]. Nevertheless, they exhibit the typical as-fired tolerance of ± 25% which requires trimming. The newly proposed concept is based on a tape-on-LTCC process. Thick film resistors are printed and fired on top of a cofired LTCC substrate. The resistors are laser trimmed and sub sequentially covered by one or more layers of LTCC in a tape-on-substrate approach. A screening and verification study of this concept was carried out using the LTCC system DP 951 from DuPont. Resistors of two series were printed and postfired on the LTCC substrate. One half of it was covered with a high temperature glass to investigate the impact of material interactions with a cover tape. The entire population was refired three times to simulate potential postfire steps. Another sub-group was laser trimmed prior to laminating and firing of a green LTCC foil onto the substrate. The detailed results of this study will be given in this paper.
Jens Mueller, Professor
Technische Universitaet Ilmenau
Ilmenau, Thuringia
Germanny


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