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Integrated ESD circuit in Low Temperature Co-fired Ceramics
Keywords: LTCC, Varistor, ESD
Low Temperature Co-fired Ceramics (LTCC), comprised of the low dielectric loss ceramic materials and the low resistance electrode materials, is the circuit substrate on which signal transmission circuits, capacitors and inductors of the high frequency band can be integrated with laminating structure. If the functional materials consisting of other compositions can be co-fired with LTCC, the superior passive elements could be integrated into the LTCC additionally. The semiconductor elements are mounted on the LTCC substrate. The ESD elements are also mounted on the LTCC ,because the ESD resistance of the semiconductors is being decreased due to the miniaturization of the wiring. However, the adding ESD elements causes the mouting cost increment and consumes the some area of the limited borad area. Therefore, we examined the integration of ESD circuit into LTCC by laminating structure. For the ESD element, it is known that Zinc Oxide based varistor has the high performance. However, since the common varistor is sintered at the higher temp. than the temp. for LTCC sintering process, it can not be integrated into LTCC by simultaneous sintering. Hence, we studied the conditions which enable the simultaneous sintering of LTCC and varistor, and could obtain good varistor properties. Furthermore, we found that the possibility of the integration of varistor circuit into the inside of LTCC by laminating low dielectric loss ceramic materials, Ag electrode and varistor layer by using sheet casting technology.
Naoyuki Okamoto,
Hitachi Metals Ltd.
Mishima-gun, Osaka
Japan


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