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Performance improvement of heat sink with carbon nanotube array
Keywords: carbon nanotubes, heat sink, patterned structure
The performance of heat sink has been arisen as a serious issue with the shrinking size and larger power density of microelectronic devices. Carbon nanotube (CNT), as a high thermal conductive nanomaterial, is a promising candidate for the heat sink used in novel microelectronic devices. In this paper, two kinds of carbon nanotubes, sponge CNTs and CNT array, were used to fabricate the heat sink. Heat sink based on SiO2 structure was also employed for comparison. The working performance of the fabricated heat sinks was measured with a back-side heating configuration chip. It is shown that by using CNT based heat sink, the heat dissipation performance is improved. The temperature rise caused by heating can decrease to 66% with the CNT array-based heat sink. However, the sponge CNTs exhibit poorer heat dissipation performance than CNT array. The performance difference of two kinds of CNT is discussed and considered to be related with the CNT structure determined heat transfer path. Although higher temperature rises were observed in the SiO2 based heat sink than CNT based ones, it is shown that the heat dissipation performance of SiO2 based heat sink can be improved by introducing patterned structure.
Taisong Pan,
State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China
Chengdu, Sichuan
China


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