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Insulating Ceramic Layers Fabricated by Aerosol Deposition for Circuit Boards of High Power Electronics
Keywords: aerosol deposition (AD), insulating ceramic layer, high power device
The demand of high power devices such as light-emitting diode (LED) illumination and inverter modules continues to grow for automotive applications and smart grid systems. In their applications, thermal management is the most crucial issues because heat dissipation affects the functional performance and reliability of high power devices. One of the approaches is insulating ceramic layer fabrication on metal substrates by aerosol deposition (AD). Aerosol deposition is a ceramic film fabrication method based on consolidation by impact of powder particles on to a substrate, and excellent features such as a high deposition rate and low process temperature. For these advantageous features, the AD method is applied for a wide range of device development and various uses with ceramic materials. By the AD method, dense ceramic films can be deposited at room temperature. In this research, insulating ceramic layers were fabricated on metal substrates by the AD method and the insulating and mechanical properties of the fabricated layers were investigated.
Hiroki Tsuda,
1National Institute of Advanced Industrial Science and Technology (AIST)
Tsukuba, Ibaraki

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