Abstract Preview

Here is the abstract you requested from the cicmt_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Constrained sintering of a low-fire, polycrystalline Bi2(Zn1/3Nb2/3)2O7 dielectric
Keywords: constrained sintering, LTCC, dielectric materials
The densification behavior and stress development of a low-fire, polycrystalline Bi2(Zn1/3Nb2/3)2O7 (BZN) dielectric during constrained sintering have been studied. Poorer densification and larger porous bulk viscosity are observed for the BZN densified under pressure-less constrained sintering in comparison to free sintering. This is caused by the in-plane tensile stress generated in the transverse directions of the laminate during constrained sintering. The applied uniaxial stress required in the thickness direction to densify BZN under constrained sintering at 825-875oC varies in the range of 100-600 kPa, consistent with those calculated theoretically.
Jau-Ho Jean, Professor
National Tsing Hua university
Hsinchu , Taiwan

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic