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Percolative BaTiO3 Composite Films Fabricated by Aerosol Deposition
Keywords: BaTiO3, Cu, Composite
High-permittivity percolative insulator-conductive filler composites have provided the possibilities for the development of high-capacity capacitors. These composites show a huge change in the dielectric permittivity when the volume fraction of the fillers approaches the percolation threshold. These unique dielectric properties based on percolation theory have been researched as a very promising research for high-permittivity materials. However, in the case of polymer-conductive filler composites with good mechanical flexibility, high dielectric loss and high frequency dependence of dielectric properties are considered as the main problems. In contrast with that, ceramic-metal composites using ferroelectric materials show low loss and low frequency dependence of that. However, they focused on the fabrication of bulk-type composites. And also, high sintering temperature for the ceramic materials places limits on the selection of various filler materials. In this research, we presented high-permittivity BaTiO3-based composite dielectric films fabricated by an aerosol deposition (AD) process with various conductive fillers at room temperature. The AD process is based on shock loading solidification due to the impact of ultra-fine particles accelerated through a nozzle by carrier gases, as described elsewhere. For instance, the relative dielectric permittivity of BaTiO3-Cu composite films fabricated by the AD process at room temperature was over 300 with low dielectric loss. Additionally, post-annealed BaTiO3-Cu composite films at 400oC show high dielectric permittivity over 500 with low dielectric loss. These superior dielectric properties show that the AD process has great possibilities as the fabrication process of the percolative composite films for the high-capacity capacitors. The fabrication and characterization of percolative BaTiO3-based composite films with various conductive fillers will be presented.
Yoon-Hyun Kim,
Waseda University, National Institute for Materials Science, Kwangwoon University
Tsukuba, Ibaraki

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