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Bonding process using metal nanoparticles for high-temperature applications
Keywords: metal nanoparticles, bonding process, solder alternative
The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal nanoparticles, the bonding process using metal nanoparticles has been proposed as a solder alternative to establish a new joining technology for high-temperature applications. In this study, Cu nanoparticle paste was experimentally applied and the effect of joining process conditions on the joint strength of Cu-to-Cu joint using Cu nanoparticle paste was mainly investigated. And, the effect of the addition of Ag nanoparticles paste into Cu nanoparticle paste on the joint strength has been also studied to improve joint strength using Cu nanoparticle paste. As a result, it was found that the Cu-to-Cu joining using Cu nanoparticle paste was successfully achieved, and there was an effect of Ag nanoparticle paste addition on the joining strength of the Cu-to-Cu joint.
Hiroshi Nishikawa,
Joining and Welding Reserch Institute, Osaka University
Ibaraki, Osaka
JAPAN


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