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Characterization of BiAgX Solder Paste on Thick Film for 200oC Applications
Keywords: Solder, High Temperature, Reliability
AgBiXTM (Indium Corporation) solder paste has a liquidus temperature of ~271℃ after reflow, which is suitable for semiconductor and power die attach for 200℃ underhood automotive applications. In this work, the alloy has been used to assemble SiC die with Ti/Ni/Ag thin film metallization to Ag and PdAg thick film substrates. High temperature storage testing (200℃) and thermal cycle testing (-55℃ to 195℃) were preformed to characterize the reliability of assemblies. Surface mount chip resistor attach on thick film substrates were also subject to high temperature storage and thermal cycling testing. Comparison of the performance of die attach and resistor attach on Ag substrates and PdAg substrates are made. EDX and failure analysis was used to understand the role of Pd on the failure mode and lower aged shear strengths with the thick film PdAg conductors.
Zhenzhen Shen, Ph.D Student
Auburn University
Auburn, AL
USA


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