Here is the abstract you requested from the hitec_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Enhancing performance and reliability of high temperature electronics through thermally stable Parylene HT|
|Keywords: Parylene HT, Performance , Reliability|
|A significant performance and reliability challenges exist for high temperature electronics used in many applications including those used in down-hole, under-bonnet, well-logging and aero-engine applications. Under high temp operating environments, the life expectancy of electronic components and systems reduces exponentially if they are not designed, packaged and protected appropriately to tolerate or negate the impact of high temperatures. This presentation highlights specific materials and conformal coating issues that play a significant role in addressing above challenges and presents results of thermal aging effect on Parylene HT at 200oC and up to 450oC. In addition, it provides an in-depth analysis of the performances at high temperature and offers solutions through to some of the existing current issues through incorporating Parylene HT in the design and final protection of high temp electronics. This presentation also highlights possible applications for wafer level packaging, comparison with existing Parylene and other polymers, and its compliance to various industry/regulatory standards including RoHS compliant and halogen free (per IEC-60754-2) electronics|
|Rakesh Kumar, Vice President of Technology
Specialty Coating Systems, Inc.