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Modeling of thermomechanical behaviour of wire bonded electronic devices under combined thermal and vibration loads
Keywords: Wire bonding, Reliability, FEA
The reliability of microelectronic devices used in aerospace applications is critical in order to avoid failures during operation. In such applications, electronic devices are expected to operate satisfactorily in a combination of loading conditions such as high temperature, temperature cycling, vibration and shock. Research has shown that microelectronic interconnections are responsible for 30% of the field failures; 55% of those failures are related to temperature and 20% to vibration and shock [1]. Wire bonding is the preferred interconnection method in aerospace industry due to its compliance and hence high reliability [2]. Separate reliability tests for qualification of electronic devices do not provide a realistic view during operation in a combined environment. Previous experimental work on the combined effects of thermal and vibration loadings on wire-bonded devices has shown that when such environmental factors are combined there is an increased susceptibility of the interconnections to failure compared to environmental tests of single loading [3-6]. This paper has extended the investigation of the combined effects of thermal and vibration loadings by numerical and finite element analysis (FEA) of the stresses and strains in gold ball-wedge wire bonded devices. The finite element model is established to predict the stresses and strains induced in the bond wires by analysing the dissimilar thermal coefficient of expansions which are affected by temperature, the excitation frequency of the bond wires during vibration and the subsequent changes from different wire bonding profiles. The FEA results are validated and compared with the experimental results from the combined high temperature and vibration reliability tests.
Richard Man, Student
Loughborough University
Loughborough, Leicestershire

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